FerriSSD PCIe Gen 4 - for industrial & automotive use - Silicon Motion

FerriSSD with PCIe Gen 4 x4 delivers over 6GB/s read and 4GB/s write speeds in a compact 16 × 20 mm BGA package.
With up to 1TB capacity and extended temperature support, it integrates 3D NAND, controller, and passives.
Simplifying design, speeding deployment, and solving NAND migration challenges for high-performance AI systems.

Key features

Data Reliability	LDPC engine for strong error correction & end-to-end CRC protection.
Robust Data Protection	System-level power protection and enterprise-grade LDPC with metadata for reliable error correction.
SSD Status Monitoring	SMART/Telemetry support and FerriSSD IntelligentLog enable advanced SSD status and event tracking.
Advanced Global Wear Leveling	Uniform cell usage across dies extends lifespan with low wear leveling and write amplification overhead.
Easy-to-Use	The Plug & Plug device only requires format/fdisk prior to use
Option	Digitally signed firmware with eFuse for enhanced security

Specifications SM681G*-Bx

Host Interface	PCIe Gen4 x4 Lane
PCIe Protoca	NVMe 2.0 with NVMe MI Appendix C Specification
Density	120~960GB 3D TLC ; 32~320GB 3D SLCMode
HMB support	DRAM-less with optional HMB
Form Factor	20mm x 16mm BGA
Temperature	Commercial (0°C to + 70°C) | Industrial (-40°C to + 85°C) Automotive (-40°C to + 105°C)
Compliant to	RoHS 2.0 / Halogen Free

FerriSSD ensures enterprise-grade reliability with NANDXtend® ECC and end-to-end data protection, supports secure remote firmware updates, and offers SR-IOV for scalable, secure deployment.

These FerriSSD PCIe Gen 4 are also available on M.2 modules
 

Apollo510 SoC is now supported on the Edge Impulse™ development platform - Ambiq

Ambiq® announced that its Apollo510 System-on-Chip (SoC) is now supported on the Edge Impulse™ development platform, enabling developers to build and deploy highly efficient, scalable AI applications for edge devices across speech recognition, computer vision, healthcare monitoring, and industrial automation. 

The Apollo510 System-on-Chip (SoC), a cutting-edge solution engineered to revolutionize the landscape of ultra-low-power performance in conventional edge and AI applications. Leveraging Ambiq's advanced Subthreshold Power Optimized Technology (SPOT®), Apollo510 delivers exceptional energy efficiency, operating on minimal power while providing unparalleled performance.

Designed to meet the evolving needs of conventional edge and AI devices, the Apollo510 represents a significant leap forward in energy efficiency, performance, and security. With its unparalleled combination of ultra-low power operation, high-performance computing capabilities, and robust security features, this wireless SoC is designed to drive innovation and enable the next generation of smart and connected devices.

Features
- Up to 250 MHz Arm Cortex-M55 application processor with turboSPOT® and Helium™ technology
- Ultra-low power ADC & stereo digital microphone PDM interfaces for truly always-on voice
- High-speed USB 2.0
- Wide range of integrated sensor interfaces including ADC, SPI, I²C, and UART
- Enhanced memory performance with 64KB I-Cache & 64KB D-Cache, 3.75MB of system RAM, and 4MB of embedded non-volatile memory for code/data
 

Ultra High Definition (UHD) OLED displays - Lincoln Technology Solutions


TOP-electronics is pleased to announce the launch of Ultra High Definition (UHD) OLED displays from Lincoln Technology Solutions, offering unparalleled visual quality and robust design for professional and industrial applications.

Available in 13.3", 15.6", 18.5", 21.6", and 27" sizes, each display features a stunning 3840 x 2160 resolution for razor-sharp imagery and a breathtaking contrast ratio of 1,000,000:1.

Engineered for high-performance environments, all models deliver:
- Average luminance of 400 cd/m² for bright, vibrant displays
- 99% DCI-P3 color gamut coverage for cinematic color fidelity
- eDP (Embedded DisplayPort) interface for seamless integration
- Long life support of 5+ years, ideal for long-term projects and product designs
- Wide operating temperature range of -20°C to +70°C, ensuring reliability in demanding conditions
- On-Cell Touch integration for the 13.3" & 18.5" models, with touch functionality optional on all other sizes

These OLED displays are a significant leap forward in display technology. They have been engineered to give not just stunning visual quality, but also to offer long-term reliability and flexibility to our customers - from design and development to volume production

This series of OLEDs is built to meet the rigorous demands of sectors such as broadcast, medical imaging, defense, industrial automation, and premium consumer applications.

With exceptional durability and consistent performance across the product life cycle, these UHD OLEDs offer a future-proof solution for any high-end display requirement.
 

Transforming spatial imaging for Smartglasses and AR/VR - Camemake

Ultra-Compact 3mm Camera Module unlocks new design possibilities. Camemake has engineered a breakthrough in spatial imaging with a 3mm-wide camera module delivering 1.3MP resolution and a 140° field of view.

Ideal for AR/VR headsets, smartglasses, and space-constrained applications. This compact form factor solves a critical bottleneck: fitting wide-angle, production-grade imaging into lightweight, ergonomic designs without sacrificing performance or reliability.

Historically, the industry was stuck at >4.5mm due to the space requirements of lenses, sensors, and connectors. Camemake’s team tackled the challenge from the ground up, redesigning optics for minimal distortion, optimizing PCB layouts, and testing new materials to shrink the module to just 3mm. The result is a camera that integrates cleanly into slim enclosures, enabling multi-camera arrays for true surround vision, precise gesture tracking, and spatial mapping.

Engineers now have a viable solution for building high-performance, low-profile devices. The module reduces thermal output, simplifies cable routing, and increases mechanical flexibility—all while maintaining industrial-grade reliability.

Camemake supports multiple platforms (Sony, OmniVision, etc.), with high-volume capabilities and full in-house QC. For prototyping or scaling, this is a plug-and-play upgrade for your next innovation.
 

Radiation Tolerant products - Apex Microtechnology

Apex has released 3 new devices in the Radiation Tolerant product portfolio.Apex is further enhancing their commitment to providing solutions for the space industry and applications in radiation-prone environments.

PA12R: 10A, 90V, Class A/B Radiation Tolerant Power Amplifier
The PA12R is a 10A, 90V state of the art high voltage, very high output current operational amplifier designed to drive resistive, inductive and capacitive loads.

This hybrid integrated circuit utilizes thick film (cermet) resistors, ceramic capacitors and semiconductor chips to maximize reliability, minimize size and give top performance. The 8-pin TO-3 package is hermetically sealed and electrically isolated.

PA74R: 40V, 3A PEAK, Dual Radiation Tolerant Power Amplifier
The PA74R is a dual power operational amplifier featuring 2.5A x 2 of continuous output current on 5V to 40V single supplies. The product design for the PA74R utilizes both monolithic and hybrid technologies by placing two ICs in an electrically isolated, hermetically sealed, 8-pin TO-3 metal package.

The result is a cost-effective solution for applications requiring multiple amplifiers per board or bridge-mode configurations.

PA02R: 350kHz, 5A, Radiation Tolerant Power Amplifier with Fast Settling Time
The PA02R is a 5A, 38V power operational amplifier with a very high 350kHz power bandwidth designed to drive resistive, inductive and capacitive loads such as motor, valve and actuator controls.

The PA02R provides a complementary “collector output” stage that can swing close to the supply rails and is protected against inductive kickback. Low crossover distortion and internal losses make this device efficient when system voltages are low, and power is a premium.
 

Terminal Blocks - Power meets precision - Degson 

Discover the perfect connection with Degson’s EDGKN series terminal blocks – available in 3.5mm and 3.81mm pitch.

Engineered for compact design, reliable performance, and effortless installation, these terminal blocks are your go-to solution for modern PCB connectivity.

Key features:

- Pitch options: 3.5 mm & 3.81 mm
- Push-in connection for fast, tool-free wiring
- High current capacity – up to 8A (3.5 mm) / 8A–10A (3.81 mm)
- Rated voltage: up to 160V (3.5 mm) / 300V (3.81 mm)
- Compact & modular design – perfect for automation, control, and LED systems
- Flame-retardant housing (UL94 V-0)